NEN-EN-IEC 61190-1-3
Attachment materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
inactive
| Organization: | NEN |
| Publication Date: | 1 September 2002 |
| Status: | inactive |
| Page Count: | 80 |
| ICS Code (Electronic component assemblies): | 31.190 |
scope:
Prescribes the requirements and test methods for electronic grade solder alloy, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders.
Document History
October 1, 2010
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
A description is not available for this item.
August 1, 2007
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
NEN-EN-IEC 61190-1-3
September 1, 2002
Attachment materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Prescribes the requirements and test methods for electronic grade solder alloy, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering...