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NEN-EN-IEC 61190-1-3/A1

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

active, Most Current
Organization: NEN
Publication Date: 1 October 2010
Status: active
ICS Code (Electronic component assemblies): 31.190

Document History

NEN-EN-IEC 61190-1-3/A1
October 1, 2010
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
A description is not available for this item.
August 1, 2007
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
September 1, 2002
Attachment materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Prescribes the requirements and test methods for electronic grade solder alloy, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering...
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