NEN-EN-IEC 61190-1-3/A1
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 October 2010 |
| Status: | active |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
NEN-EN-IEC 61190-1-3/A1
October 1, 2010
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
A description is not available for this item.
August 1, 2007
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
September 1, 2002
Attachment materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Prescribes the requirements and test methods for electronic grade solder alloy, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering...