NEN-EN-IEC 62374-1
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
active
| Organization: | NEN |
| Publication Date: | 1 December 2010 |
| Status: | active |
| Page Count: | 24 |
| ICS Code (Semiconductor devices): | 31.080 |
scope:
This part of IEC 62374 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
Document History
April 1, 2011
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
A description is not available for this item.
NEN-EN-IEC 62374-1
December 1, 2010
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
This part of IEC 62374 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor...