NEN 10249-2-12
Base materials for printed circuits - Part 2: Specifications - Specification No. 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards
inactive
| Organization: | NEN |
| Publication Date: | 1 April 1994 |
| Status: | inactive |
| Page Count: | 28 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This specification gives requirements for properties of thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of mulitlayer printed boards. Laminated sheets covered by this specification have thicknesses (of the base laminate, excluding the copper foil) not greater than 0.8 mm (0.031 in). Although primarily intended for multilayer boards, the materials may be used for single-sided or double-sided printed boards.
Document History
November 1, 1995
Base materials for printed circuits - Part 2: Specifications - Specification No. 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards
A description is not available for this item.
NEN 10249-2-12
April 1, 1994
Base materials for printed circuits - Part 2: Specifications - Specification No. 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards
This specification gives requirements for properties of thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of mulitlayer printed boards....
April 1, 1994
Base materials for printed circuits - Part 2: Specifications - Specification No. 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards
This specification gives requirements for properties of thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards....