NEN-IEC 60191-5
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 January 1998 |
| Status: | active |
| Page Count: | 84 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. This standard is applicable to the finished component supplied by a manufacturer to a user and does not define requirements relating to the IC tape interface (the inner lead bond or ILB).
Document History
NEN-IEC 60191-5
January 1, 1998
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. This standard is...