NEN - NPR 10191-5
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to tape automated bonding (TAB) of integrated circuits
inactive, Most Current
| Organization: | NEN |
| Publication Date: | 1 September 1991 |
| Status: | inactive |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
The recommendations contained in this standard cover the requirements resulting from the sale of tape with or without bonded integrated circuits by a manufacturer to a user. They are not intended to govern strictly internal usage such as the use of TAB as one step in the manufacture of DIL packages or "chip carriers". Dimension values or requirements given in this standard for tape width, perforations, test pattern, outer lead bonding (OLB), etc., correspond to the state of the market at the date of publication of this standard. More especially, type width and perforation dimensions have been derived from motion picture film standards.
Document History
NPR 10191-5
September 1, 1991
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to tape automated bonding (TAB) of integrated circuits
The recommendations contained in this standard cover the requirements resulting from the sale of tape with or without bonded integrated circuits by a manufacturer to a user. They are not intended to...