NEN-EN-IEC 60749-3
Semiconductor devices - Mechanical en climatic test methods - Part 3: External visual inspection
inactive
| Organization: | NEN |
| Publication Date: | 1 September 2002 |
| Status: | inactive |
| Page Count: | 20 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
To verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance, or both.
Document History
July 1, 2017
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
The purpose of NEN-EN-IEC 60749-3 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement...
NEN-EN-IEC 60749-3
September 1, 2002
Semiconductor devices - Mechanical en climatic test methods - Part 3: External visual inspection
To verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a...