NEN-EN-IEC 60749-21
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
inactive
| Organization: | NEN |
| Publication Date: | 1 March 2005 |
| Status: | inactive |
| Page Count: | 32 |
| ICS Code (Semiconductor devices): | 31.080 |
scope:
Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
Document History
September 1, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
This part of IEC 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or...
NEN-EN-IEC 60749-21
March 1, 2005
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder...