NEN-EN-IEC 60749-15/C11
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 February 2011 |
| Status: | active |
| Page Count: | 3 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
NEN-EN-IEC 60749-15/C11
February 1, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
A description is not available for this item.
January 1, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are...
June 1, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the remperature to which they are subjected during soldering of...