NEN-EN-IEC 60749-15
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
inactive
| Organization: | NEN |
| Publication Date: | 1 June 2003 |
| Status: | inactive |
| Page Count: | 26 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the remperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.
Document History
February 1, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
A description is not available for this item.
January 1, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are...
NEN-EN-IEC 60749-15
June 1, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the remperature to which they are subjected during soldering of...