NEN-EN-IEC 61189-1
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
active
| Organization: | NEN |
| Publication Date: | 1 August 1997 |
| Status: | active |
| Page Count: | 66 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
Is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.
Document History
December 1, 2001
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
A description is not available for this item.
November 1, 1997
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
A description is not available for this item.
NEN-EN-IEC 61189-1
August 1, 1997
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
Is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.