NEN-EN-IEC 61189-1/C1
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
active
| Organization: | NEN |
| Publication Date: | 1 November 1997 |
| Status: | active |
| Page Count: | 1 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
December 1, 2001
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
A description is not available for this item.
NEN-EN-IEC 61189-1/C1
November 1, 1997
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
A description is not available for this item.
August 1, 1997
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
Is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.