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ISO 29864

Self adhesive tapes - Measurement of breaking strength and elongation at break

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Organization: ISO
Publication Date: 15 December 2007
Status: inactive
Page Count: 12
ICS Code (Adhesives): 83.180

Document History

ISO 29864
May 1, 2018
Self adhesive tapes - Measurement of breaking strength and elongation at break
This document specifies methods to measure the breaking strength and elongation at break of a self adhesive tape when it is subjected to a tensile force sufficient to cause it to break. These test...
ISO 29864
December 15, 2007
Self adhesive tapes - Measurement of breaking strength and elongation at break
A description is not available for this item.

References

This document is referenced by:
GMW16740 - Tape for Wiring Harness
Published by GMW on June 1, 2017
Introduction Note: Nothing in this standard supercedes applicable laws and regulations. Note: In the event of conflict between the English and domestic language, the English language shall take...
This document is referenced by:
GME15489 - Harness Tape
Published by GME on February 1, 2015
There is no international or national equivalent ot this standard.
This document is referenced by:
IEC 62878-1-1 - Device embedded substrate - Part 1-1: Generic specification - Test methods
Published by IEC on May 1, 2015
This part of IEC 62878 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are...
This document is referenced by:
EN IEC 62878-1 - Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
Published by CENELEC on December 1, 2019
This part of IEC 62878 specifies the generic requirements and test methods for deviceembedded substrates. The basic test methods for printed board substrate materials and substrates themselves are...
This document is referenced by:
IEC 62326-20 - Printed boards – Part 20: Printed circuit boards for high-brightness LEDs
Published by IEC on February 1, 2016
This part of IEC 62326 specifies the properties of the printed circuit board (hereafter described as PCB) for high-brightness LEDs. Many aspects of the PCB for high-brightness LEDs are identical with...
This document is referenced by:
CEI EN IEC 62878-1 - Device embedding assembly technology Part 1: Generic specification for device embedded substrates
Published by CEI on May 1, 2020
This part of IEC 62878 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are...
This document is referenced by:
EN 62326-20 - Printed boards - Part 20: Printed circuit boards for highbrightness LEDs
Published by CENELEC on May 1, 2016
This part of IEC 62326 specifies the properties of the printed circuit board (hereafter described as PCB) for high-brightness LEDs. Many aspects of the PCB for high-brightness LEDs are identical with...
This document is referenced by:
DIN EN 62326-20 - Printed boards - Part 20: Printed circuit boards for high-brightness LEDs (IEC 62326-20:2016); German version EN 62326-20:2016
Published by DIN on December 1, 2016
Dieser Teil von IEC 62326 legt die Eigenschaften der Leiterplatte (PCB) (en: Printed Circuit Board) für Hochleistungs-LEDs fest. Da Leiterplatten für Hochleistungs-LEDs in vielerlei Hinsicht...
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