Spherical Bend Test Method for Characterization of Board Level Interconnects
|Publication Date:||1 May 2018|
This standard specifies a common method of establishing strain limits of board-level device interconnects under spherical transient bending conditions, the worst-case flexure condition that can occur during conventional printed board/system assembly, manufacturing, and test operations. This standard is only applicable to transient bending during short-term test operations. Long-term load conditions with static strain levels, such as the compressive load of a heat sink on a BGA, are outside the scope of this document. This method is applicable to surface mounted Ball Grid Array (BGA) components larger than 15.0 mm on a side with organically based substrates, attached to printed boards using conventional solder reflow technologies. While it is possible to test alternate or smaller packages, some of the tests may need to be modified. Spherical bend test pass/fail requirements are typically specific to each device application and are outside the scope of this document. Applicability of this test method and its associated parameters should be based on expected manufacturing conditions.