IPC - TM-650 2.2.14.3
Determination of Maximum Solder Powder Particle Size
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 January 1995 |
| Status: | active |
| Page Count: | 2 |
scope:
This test method is designed to determine the maximum (average) solder particle size in a solder paste using a fineness of grind gauge.
Document History
TM-650 2.2.14.3
January 1, 1995
Determination of Maximum Solder Powder Particle Size
This test method is designed to determine the maximum (average) solder particle size in a solder paste using a fineness of grind gauge.