IEC/PAS 60191-6-19
Mechanical standardization of semiconductor devices – Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
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| Organization: | IEC |
| Publication Date: | 1 January 2008 |
| Status: | inactive |
| Page Count: | 26 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
February 1, 2010
Mechanical standardization of semiconductor devices – Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
This part of IEC 60191 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA),...
IEC/PAS 60191-6-19
January 1, 2008
Mechanical standardization of semiconductor devices – Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
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