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IEC 60191-6-19

Mechanical standardization of semiconductor devices – Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

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Organization: IEC
Publication Date: 1 February 2010
Status: active
Page Count: 30
ICS Code (Semiconductor devices in general): 31.080.01
scope:

This part of IEC 60191 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA).

Document History

IEC 60191-6-19
February 1, 2010
Mechanical standardization of semiconductor devices – Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
This part of IEC 60191 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA),...
January 1, 2008
Mechanical standardization of semiconductor devices – Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
A description is not available for this item.

References

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