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JEDEC JEP 154

Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress

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Organization: JEDEC
Publication Date: 1 January 2008
Status: inactive
Page Count: 30
scope:

This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. The method is valid for Sn/Pb eutectic, high Pb, and Pb-free solder bumps. The document discusses the advantages and concerns associated with EM testing, as well as options for data analysis. 

Document History

January 1, 2008
Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress
This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages....
JEDEC JEP 154
January 1, 2008
Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress
This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages....

References

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