JEDEC JEP 154
Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress
|Publication Date:||1 January 2008|
This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. The method is valid for Sn/Pb eutectic, high Pb, and Pb-free solder bumps. The document discusses the advantages and concerns associated with EM testing, as well as options for data analysis.