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JEDEC JEP 154

Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress

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Organization: JEDEC
Publication Date: 1 January 2008
Status: inactive
Page Count: 30
scope:

This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. The method is valid for Sn/Pb eutectic, high Pb, and Pb-free solder bumps. The document discusses the advantages and concerns associated with EM testing, as well as options for data analysis. 

Document History

JEDEC JEP 154
January 1, 2008
Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress
This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages....
JEDEC JEP 154
January 1, 2008
Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress
This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages....

References

This document is referenced by:
IEC TS 62686-1 - Process management for avionics – Electronic components for aerospace, defence and high performance (ADHP) applications – Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
Published by IEC on April 1, 2020
This part of IEC 62686, which is a Technical Specification, defines the minimum requirements for general purpose "off the shelf" COTS (commercial off-the-shelf) integrated circuits and discrete...
This document is referenced by:
JEDEC JESD 88 - JEDEC Dictionary of Terms for Solid State Technology
Published by JEDEC on July 1, 2007
Each term and definition in this dictionary has been included strictly for application within the solid-state industry. Many of the terms and definitions in this dictionary may have applicability...
This document is referenced by:
BS PD IEC TS 62686-1 - Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
Published by BSI on April 30, 2020
A description is not available for this item.
This document is referenced by:
JEDEC JEP 70 - Guide to Standards and Publications Relating to Quality and Reliability of Electronic Hardware
Published by JEDEC on October 1, 2013
This publication contains a listing and description of commonly used quality and reliability related publications applicable to the semiconductor industry. It is intended to be a reference aid in...
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