JEDEC JEP 154
Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress
|Publication Date:||1 January 2008|
This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. The method is valid for Sn/Pb eutectic, high Pb, and Pb-free solder bumps. The document discusses the advantages and concerns associated with EM testing, as well as options for data analysis. The tests are performed on packaged bump electromigration test devices. The bump electromigration test techniques described in this document can be used to assess the electromigration reliability of different types of solder bumps and metallizations, to make materials decisions, and to establish maximum bump current specifications. Thermal migration is also known to exist, but is outside the scope of this document.