JEDEC JEP 176
ADAPTER TEST BOARD RELIABILITY TEST GUIDELINES
|Publication Date:||1 January 2018|
This publication describes guidelines for applying JEDEC reliability tests and recommended testing procedures to integrated circuits that require adapter test boards for electrical and reliability testing. These tests are used frequently in qualifying integrated circuits as a new product, a product family, or as products in a process which is being changed.
Integrated circuit devices in various packages that cannot be tested directly with the Automated Test Equipment (ATE) are each mounted on an adapter test board for testing. Some common devices mounted on adapter test boards for test purposes are Chip-Scale Package, Flip-Chip Die, and Fine-Pitch Package devices (e.g., 64-Lead QFN package with 0.50-mil lead pitch).
This document provides guidelines for adapter test board-level reliability tests, recommended testing procedures, test board designs, and construction materials. It is aimed to provide a reproducible assessment of the reliability performance of integrated circuit devices while duplicating the failure modes normally observed during product life cycle. The reliability test recommendations do not apply to the following:
a) Integrated circuits that are stressed and/or tested in an electrical socket.
b) WLCSP devices that are stressed and/or tested using a wafer-level probe card.
c) Second-level solder joint reliability tests such as drop test, thermal cycle test, bend test, etc.
These reliability tests are capable of evaluating and simulating package and device failures in an accelerated manner compared to use conditions. The guidelines prescribed in this publication are not aimed for reliability tests for devices in extreme use conditions such as military applications, automotive under-the-hood applications, or uncontrolled avionics environments. Each reliability test should be examined for:
a) Any potential new and unique failure mechanisms, b) Any situation where these tests and/or conditions may induce false failures