ECIA - EIA-364-56
TP-56D RESISTANCE TO SOLDERING HEAT TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS
Organization: | ECIA |
Publication Date: | 28 February 2008 |
Status: | inactive |
Page Count: | 20 |
scope:
This standard establishes a test method for determining whether connectors can withstand the effects of the heating and/or environment that they will be subjected to during the soldering of their terminations by solder dip, soldering iron, solder wave, or reflow soldering techniques.
Object
The heat and/or environment of soldering may affect the electrical characteristics of the connector and may cause damage to the materials making up the connector. It may also result in loosening of terminations, softening or distortion of insulation materials, opening of solder seals, weakening of mechanical joints, etc.
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