scope:

This standard prescribes NASA's technical requirements, procedures, and documentation requirements for polymeric applications for electrical and electronic assemblies. These requirements may be tailored to the program applications via the engineering documentation (See Sections 1.3, 1.4 and 4.1.3).

Purpose

This publication sets forth requirements for staking, conformal coating, bonding, and encapsulation of components used in electronic hardware.

Applicability

This publication is applicable to NASA programs involving polymeric applications for flight hardware, mission critical ground support equipment, and elements thereof and wherever invoked contractually.

Special Requirements

Special requirements may exist that are not in conformance with the requirements of this publication. Engineering documentation shall contain the details for such requirements, including modifications to existing equipment, and shall take precedence over appropriate portions of this publication when approved in writing by the procuring NASA Center (Requirement).

Approval of Departures from this Standard 

Minor departures from this standard require written approval from the cognizant NASA contracting officer. The supplier is responsible for assuring that any departures from this publication are evaluated by, coordinated with, and submitted to the procuring NASA Center for approval prior to use or implementation. Departures which reduce the requirements herein may warrant a request for waiver of associated requirements in NPD 8730.5, per NASA Procedural Requirements (NPR) 8715.3, NASA General Safety Program Requirements. 

For in-house NASA projects, this publication requires written approval by the in-house NASA project management to deviate from the provisions herein.