scope:

This standard prescribes NASA's technical and quality assurance requirements for polymeric applications for electrical and electronic assemblies.

Purpose

This publication sets forth requirements for staking, conformal coating, bonding, and encapsulation of components used in electronic hardware.

Applicability

This standard is applicable to NASA Headquarters and NASA Centers, including Component Facilities and Technical and Service Support Centers. This language applies to the Jet Propulsion Laboratory (a Federally-Funded Research and Development Center), other contractors, recipients of grants, cooperative agreements, or other agreements only to the extent specified or referenced in the applicable contracts, grants, or agreements.

This standard applies to production and processing of mission hardware as defined by NPR 8735.2, Hardware Quality Assurance Program Requirements for Programs and Projects. Use of the term "supplier" applies to any entity who is manufacturing or processing mission hardware in accordance with the requirements herein including NASA Centers, NASA prime contractors, and subcontractors.

In this standard, all mandatory actions (i.e., requirements) are denoted by statements containing the term "shall." The terms "may" denotes a discretionary privilege or permission, "can" denotes statements of possibility or capability, "should" denotes a good practice and is recommended, but not required, "will" denotes expected outcome, and "are/is" denotes descriptive material.