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IPC-6013 GERMAN

Qualification and Performance Specification for Flexible Printed Boards

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Organization: IPC
Publication Date: 1 November 2003
Status: inactive
Page Count: 56
scope:

Diese Spezifikation deckt die Anforderungen an die Qualifikation und Leistungsspezifikation für flexible Leiterplatten ab. Die flexible Leiterplatte kann einseitig, zweiseitig, als Multilayer oder Starrflex-Multilayer ausgeführt sein. Alle diese Aufbauvarianten können, müssen aber nicht, Versteifungen, durchmetallisierte Löcher und Sacklöcher/vergrabene Löcher enthalten.

Document History

IPC-6013 GERMAN
January 1, 2009
Qualification and Performance Specification for Flexible Printed Boards
Diese Spezifikation deckt die Anforderungen an die Qualifikation und Leistungsspezifikation für flexible Leiterplatten ab. Die flexible Leiterplatte kann einseitig, zweiseitig, als Multilayer oder...
IPC-6013 GERMAN
November 1, 2003
Qualification and Performance Specification for Flexible Printed Boards
Diese Spezifikation deckt die Anforderungen an die Qualifikation und Leistungsspezifikation für flexible Leiterplatten ab. Die flexible Leiterplatte kann einseitig, zweiseitig, als Multilayer oder...

References

This document references:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on June 1, 2018
A description is not available for this item.
This document references:
IPC-2223 - Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
Published by IPC on January 1, 2020
This standard establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures. The...
This document references:
IPC-4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards
Published by IPC on March 1, 2017
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic...
This document references:
IPC-4103 - Specification for Base Materials for High Speed/High Frequency Applications
Published by IPC on November 1, 2017
This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital...
This document references:
IPC-4202 - Flexible Base Dielectrics for Use in Flexible Printed Boards
Published by IPC on December 1, 2016
This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed...
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