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BSI - BS EN 61188-5-8

Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

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Organization: BSI
Publication Date: 30 May 2008
Status: active
Page Count: 34
ICS Code (Printed circuits and boards): 31.180

Document History

BS EN 61188-5-8
May 30, 2008
Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
A description is not available for this item.

References

This document references:
IEC 60068-2-58 - Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by IEC on July 1, 2017
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD) This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
IEC 62090 - Product package labels for electronic components using bar code and twodimensional symbologies
Published by IEC on April 1, 2017
This document applies to labels on the packaging of electronic components for automatic handling in B2B processes. These labels use linear bar code and two-dimensional (2D) symbols. Labels for direct...
This document references:
IEC 61191-1 - Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by IEC on September 1, 2018
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
This document references:
IEC 60191-2 - Amendment 2 Mechanical standardization of semiconductor devices – Part 2: Dimensions
Published by IEC on June 1, 2001
A description is not available for this item.
This document is referenced by:
BS EN 61188-7 - Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
Published by BSI on September 30, 2017
A description is not available for this item.
This document is referenced by:
BS EN 62137-1-5 - Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
Published by BSI on July 31, 2009
A description is not available for this item.
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