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BSI - BS EN 60738-1-4

Thermistors - Directly heated positive stepfunction temperature coefficient - Part 1-4: Blank detail specification - Sensing application - Assessment level EZ

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Organization: BSI
Publication Date: 30 June 2008
Status: active
Page Count: 16
ICS Code (Thermistors): 31.040.30

Document History

BS EN 60738-1-4
June 30, 2008
Thermistors - Directly heated positive stepfunction temperature coefficient - Part 1-4: Blank detail specification - Sensing application - Assessment level EZ
A description is not available for this item.
BS EN 60738-1-4
April 15, 1999
Thermistors - Directly Heated Positive Step-Function Temperature Coefficient - Part 1-4: Blank Detail Specification - Sensing Application - Assessment Level EZ
A description is not available for this item.

References

This document references:
60738-1 - Thermistors – Directly heated positive temperature coefficient – Part 1: Generic specification
Published by IEC on October 1, 2022
This part of IEC 60738 describes terms and methods of test for positive step-function temperature coefficient thermistors, insulated and non-insulated types, typically made from ferro-electric...
This document references:
IEC 60068-2-58 - Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by IEC on July 1, 2017
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD) This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
BS EN 60738-1 - Thermistors - Directly heated positive temperature coefficient - Part 1: Generic specification
Published by BSI on July 31, 2006
A description is not available for this item.
This document references:
EN 60068-2-58 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by CENELEC on May 1, 2015
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This document provides procedures for determining the solderability, resistance to dissolution of metallization...
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