AFNOR - NF EN 61190-1-2
Attachment materials for electronic assembly - Part 1-2 : requirements for soldering paste for high-quality interconnects in electronics assembly
inactive
| Organization: | AFNOR |
| Publication Date: | 1 May 2008 |
| Status: | inactive |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
October 24, 2014
Attachment materials for electronic assembly - Part 1-2 : requirements for soldering pastes for high-quality interconnects in electronics assembly
A description is not available for this item.
NF EN 61190-1-2
May 1, 2008
Attachment materials for electronic assembly - Part 1-2 : requirements for soldering paste for high-quality interconnects in electronics assembly
A description is not available for this item.
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