AFNOR - NF EN 61190-1-2
Attachment materials for electronic assembly - Part 1-2 : requirements for soldering pastes for high-quality interconnects in electronics assembly
active, Most Current
| Organization: | AFNOR |
| Publication Date: | 24 October 2014 |
| Status: | active |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
NF EN 61190-1-2
October 24, 2014
Attachment materials for electronic assembly - Part 1-2 : requirements for soldering pastes for high-quality interconnects in electronics assembly
A description is not available for this item.
May 1, 2008
Attachment materials for electronic assembly - Part 1-2 : requirements for soldering paste for high-quality interconnects in electronics assembly
A description is not available for this item.