IPC - J-STD-005 CHINESE
Requirements for Soldering Pastes
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| Organization: | IPC |
| Publication Date: | 1 January 1995 |
| Status: | inactive |
| Page Count: | 24 |
scope:
This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.
Document History
February 1, 2012
Requirements for Soldering Pastes
A description is not available for this item.
J-STD-005 CHINESE
January 1, 1995
Requirements for Soldering Pastes
This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a quality control...