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IPC - J-STD-004 JAPANESE

REQUIREMENTS FOR SOLDERING FLUXES

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Organization: IPC
Publication Date: 1 January 2004
Status: inactive
Page Count: 20

Document History

J-STD-004C JAPANESE
January 1, 2022
Requirements for Soldering Fluxes
A description is not available for this item.
J-STD-004 JAPANESE
December 1, 2008
Requirements for Soldering Fluxes
A description is not available for this item.
J-STD-004 JAPANESE
January 1, 2004
REQUIREMENTS FOR SOLDERING FLUXES
A description is not available for this item.

References

This document references:
TM-650 2.6.3.3B - Surface Insulation Resistance, Fluxes
Published by IPC on June 1, 2004
This test method is to characterize fluxes by determining the degradation of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. This test...
This document references:
TM-650 2.6.1G - Fungus Resistance of Printed Board Materials
Published by IPC on March 1, 2007
The fungus resistance test is used to determine the resistance of materials to fungi and to determine if such material is adversely affected by fungi under conditions favorable for their development,...
This document references:
TM-650 2.6.15C - Corrosion, Flux
Published by IPC on June 1, 2004
This test method is designed to determine the corrosive properties of flux residues under extreme environmental conditions. A pellet of solder is melted in contact with the test flux on a sheet metal...
This document references:
TM-650 2.4.46A - Spread Test, Liquid, Paste or Solid Flux, or Flux Extracted from Solder Paste, Cored Wires or Preforms
Published by IPC on June 1, 2004
This test method will give an indication of activity of wave solder fluxes, core solder fluxes, and solder paste.
This document references:
TM-650 2.4.14.2A - Liquid Flux Activity, Wetting Balance Method
Published by IPC on June 1, 2004
This test method assesses the relative activity of liquid fluxes using a wetting balance.
This document is referenced by:
DSCC-DWG-89065 - GENERAL SPECIFICATION FOR HIGH PERFORMANCE, HIGH DENSITY, TWO PIECE PRINTED CIRCUIT BOARD CONNECTOR
Published by NPFC on January 19, 2018
This drawing outlines the general requirements for families of high density/high performance two piece electrical connectors, intended for printed circuit board attachment and connection, utilizing...
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