scope:

The International Standard, of which this Technical Report forms a part, has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers - singulated bare die - die and wafers with attached connection structures - minimally or partially encapsulated die and wafers This Technical Report contains a questionnaire, based on the requirements of other parts of the standard, which may be used in negotiations and contracts between suppliers and purchasers of die devices. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of the IEC 62258-1 and IEC 62258-2 standards. It should be recognised that the tables contained in this Technical Report form a checklist of information that can potentially be supplied and that it may not be relevant or possible to complete all fields. Different markets may require different subsets of the information requested herein.