scope:

The test method described in this standard shall be applied to a surface mount component with a thin
and wide basal plane, such as QFP and BGA. This test method shall evaluate the endurance of the
solder joints between component leads and lands on a substrate by cyclic bending of substrate. This
test shall evaluate the effects of repeated mechanical stress, such as key pushing in cellar phone, on
the strength of the solder joint between component terminals and lands on a substrate. In this test
method, the evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclically bend the substrate to a certain degree of depth until fracture of the solder joints occurs.