DLA - SMD-5962-95840
MICROCIRCUIT, LINEAR, 12 V LOW-DROPOUT VOLTAGE REGULATOR, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 6 November 1995 |
| Status: | inactive |
| Page Count: | 10 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 TL751M12 12 V, low-dropout voltage regulator
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 dual-in-line 2 CQCC1-N20 20 leadless chip carrier
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Continuous input voltage . . . . . . . . . . . . . . . . 26 V Transient input voltage (TA = +25°C) . . . . . . . . . . 60 V Continuous reverse input voltage . . . . . . . . . . . . −15 V Transient reverse input voltage (t ≤ 100 ms) . . . . . . . −50 V Storage temperature range . . . . . . . . . . . . . . . . −65°C to +160°C Junction temperature (TJ) . . . . . . . . . . . . . . . . +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . . 260°C Power dissipation (PD): Case outline P . . . . . . . . . . . . . . . . . . . . . 1050 mW 2/ Case outline 2 . . . . . . . . . . . . . . . . . . . . . 1375 mW 2/ Thermal resistance, junction-to-case (ΘJC) . . . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (ΘJA): Case outline P . . . . . . . . . . . . . . . . . . . . . 180°C/W Case outline 2 . . . . . . . . . . . . . . . . . . . . . 65°C/W
Input voltage range (VI) . . . . . . . . . . . . . . . . . 13 V min, 26.0 V max Ambient operating temperature range (TA) . . . . . . . . . −55°C to +125°C High-level [E bar][N bar][A bar][B bar][L bar][E bar] voltage (VIH) . . . . . . . . . . . . . . 2.0 V min, 15.0 V max Low-level [E bar][N bar][A bar][B bar][L bar][E bar] voltage (VIL), TA = +25°C 3/ . . . . . . . 0 V min, 0.8 V max Low-level [E bar][N bar][A bar][B bar][L bar][E bar] voltage (VIL), TA = −55°C to +125°C 3/ . . 0 V min, 0.8 V max Output current (IO) . . . . . . . . . . . . . . . . . . . . 480 mA
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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