Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
|Publication Date:||1 March 2009|
Statement of Scope This specification covers qualification and performance of in-process and finished printed boards (PBs) containing embedded passive circuitry with distributive capacitive planes, capacitive or resistive components.
Purpose The requirements contained herein are intended to reflect electrical, mechanical, and environmental properties unique to embedded passives. It is not intended to specify overall requirements for the PB which are already documented in the following sectional performance specifications: IPC-6012 (rigid), IPC-6013 (flex/ rigid-flex), IPC-6015 (MCM-L) or IPC-6018 (microwave).