IPC-6017
Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
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| Organization: | IPC |
| Publication Date: | 1 March 2009 |
| Status: | active |
| Page Count: | 20 |
scope:
Statement of Scope This specification covers qualification and performance of in-process and finished printed boards (PBs) containing embedded passive circuitry with distributive capacitive planes, capacitive or resistive components.
Purpose The requirements contained herein are intended to reflect electrical, mechanical, and environmental properties unique to embedded passives. It is not intended to specify overall requirements for the PB which are already documented in the following sectional performance specifications: IPC-6012 (rigid), IPC-6013 (flex/ rigid-flex), IPC-6015 (MCM-L) or IPC-6018 (microwave).
Document History
August 1, 2021
Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry
This specification covers qualification and performance of embedded active and passive circuitry within the finished printed board.
Purpose
The purpose of this standard is to define the electrical,...
IPC-6017
March 1, 2009
Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
Statement of Scope This specification covers qualification and performance of in-process and finished printed boards (PBs) containing embedded passive circuitry with distributive capacitive planes,...