UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IEC 60749-20-1

Semiconductor devices – Mechanical and climatic test methods – Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

inactive
Buy Now
Organization: IEC
Publication Date: 1 April 2009
Status: inactive
Page Count: 68
ICS Code (Semiconductor devices in general): 31.080.01

Document History

June 1, 2019
Semiconductor devices – Mechanical and climatic test methods – Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
This part of IEC 60749 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other...
IEC 60749-20-1
April 1, 2009
Semiconductor devices – Mechanical and climatic test methods – Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
A description is not available for this item.

References

Advertisement