CENELEC - EN 60749-20-1
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
active, Most Current
| Organization: | CENELEC |
| Publication Date: | 1 June 2009 |
| Status: | active |
| Page Count: | 38 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
EN 60749-20-1
June 1, 2009
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
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