scope:

This specification covers the detail requirements for monolithic silicon, CMOS/Analog logic microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided for each type and are reflected in the complete part number.

The part number shall be in accordance with MIL-M-38510.

The device type shall be as follows:

Device type Circuit 01 Single 16-channel MUX/DEMUX 02 Single 16-channel MUX/DEMUX with overvoltage protection 03 Differential 8-channel MUX/DEMUX 04 Differential 8-channel MUX/DEMUX with overvoltage protection 05 Single 8-channel MUX/DEMUX with overvoltage protection 06 Differential 4-channel MUX/DEMUX with overvoltage protection 07 Single 8-channel MUX/DEMUX 08 Differential 4-channel MUX/DEMUX

The device class shall be the product assurance level as defined in MIL-M-38510.

The case outline shall be designated as follows:

Letter Case outline (see MIL-M-38510, appendix C) E D-2 (16-lead, ¼" × ⅞"), dual-in-line package X See figure 4 (28-lead, 9/16" × 1−7/16"), dual-in-line package

Supply voltage between V+ and V−: Device types 02, 04, 05, and 06- - - - - +40 V Device types 01, 03, 07, and 08- - - - - +32 V V+ to ground: Device types 02, 04, 05, and 06- - - - - +20 V Device types 01, 03, 07, and 08- - - - - +16 V Digital input voltage: Device types 02, 04, 05, and 06- - - - - ((V −)−4 V) ≤ V_D ≤((V+) +4 V) Device types 01, 03, 07, and 08- - - - - −0.3 V ≤ V_D ≤(V+)

Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: NASA Part Project Office, Code 311.A NASA/Goddard Space Flight Center, Greenbelt, MD 20771, by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.

Analog input: Device types 02, 04, 05, and 06- - - ((V−)−20 V ≤ V_A ≤((V+)+20 V) Device types 01, 03, 07, and 08- - - (V−) ≤V_A ≤(V+) Storage temperature - - - - - - - - - −65°C to +150°C Lead temperature (soldering 10 seconds) - - - - - - - - - - - - 300°C Junction temperature (T_J) - - - - - - 175°C

V+ - - - - - - - - - - - - - - - - - - +15 V V− - - - - - - - - - - - - - - - - - - −15 V V_REF - - - - - - - - - - - - - - - - - Open V_IL (max) - - - - - - - - - - - - - - 0.8 V V_IH (min) - - - - - - - - - - - - - - Device types 01, 03, 07, and 08- - - 2.4 V Device types 02, 04, 05, and 06- - - 4.0 V VEN- - - - - - - - - - - - - - - - - - Device types 02, 04, 05, and 06- - - 4.0 V Device types 01, 03, 07, and 08- - - 4.5 V Ambient operating temperature range (T_A) - - - - - - - - - - - - - −55°C to +125°C

Case Maximum allowable Maximum Maximum Package outline power dissipation 1/ θ_JC 2/ θ_JA 16-lead DIP E 400 mW @ T_A = 125°C 50°C/W 125°C/W 28-lead DIP X 400 mW @ T_A = 125°C 51°C/W 125°C/W

intended Use:

Microcircuits conforming to this specification are intended for original equipment design application and logistic support of existing equipment.