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CENELEC - EN 60068-2-58

Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

inactive
Organization: CENELEC
Publication Date: 1 October 2004
Status: inactive
Page Count: 30
ICS Code (Electronic component assemblies): 31.190
ICS Code (Environmental testing): 19.040

Document History

EN 60068-2-58
May 1, 2015
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This document provides procedures for determining the solderability, resistance to dissolution of metallization...
EN 60068-2-58
May 1, 2015
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices...
EN 60068-2-58
October 1, 2004
Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
A description is not available for this item.
EN 60068-2-58
April 1, 1999
Environmental Testing Part 2-58: Tests - Test Td: Test Methods for Solderability, Resistance to Dissolution of Metallization and to Soldering Heat of Surface Mounting Devices (SMD)
A description is not available for this item.

References

This document is referenced by:
EN IEC 60384-21 - Fixed capacitors for use in electronic equipment - Part 21: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1
Published by CENELEC on March 1, 2019
This part of IEC 60384 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 1, for use in electronic equipment. These capacitors have metallized...
This document is referenced by:
BS EN IEC 60384-22 - Fixed capacitors for use in electronic equipment Part 22: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2
Published by BSI on March 31, 2019
A description is not available for this item.
This document is referenced by:
EN 60512-16-21 - Connectors for electronic equipment - Tests and measurements - Part 16-21: Mechanical tests on contacts and terminations - Test 16u: Whisker test via the application of external mechanical stresses
Published by CENELEC on June 1, 2012
This part of IEC 60512, when required by the detail specification, is used for testing connectors within the scope of IEC technical committee 48. It may also be used for similar devices when...
This document is referenced by:
EN 60115-8 - Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors
Published by CENELEC on September 1, 2012
This part of EN 60115 is applicable to fixed surface mount resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and...
This document is referenced by:
EN 62674-1 - High frequency inductive components - Part 1: Fixed surface mount inductors for use in electronic and telecommunication equipment
Published by CENELEC on December 1, 2012
This part of IEC 62674 applies to fixed surface mount inductors and ferrite beads. The object of this standard is to define the terms necessary to describe the inductors covered by this standard,...
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