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JEDEC JESD 22-B116

Wire Bond Shear Test Method

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Organization: JEDEC
Publication Date: 1 August 2009
Status: inactive
Page Count: 18
scope:

This test provides a means for determining the strength of a gold ball bond to a die bonding surface or an aluminum wedge or stitch bond to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. The wire bond shear test is destructive. It is appropriate for use in process development, process control and/or quality assurance.

Document History

JEDEC JESD 22-B116
April 1, 2017
Wire Bond Shear Test Method
This test provides a means for determining the strength of a ball bond to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation devices. This measure of...
JEDEC JESD 22-B116
August 1, 2009
Wire Bond Shear Test Method
This test provides a means for determining the strength of a gold ball bond to a die bonding surface or an aluminum wedge or stitch bond to a die or package bonding surface, and may be performed on...
JEDEC JESD 22-B116
July 1, 1998
Test Method B116 Wire Bond Shear Test
A description is not available for this item.

References

This document is referenced by:
IEC TS 62686-1 - Process management for avionics – Electronic components for aerospace, defence and high performance (ADHP) applications – Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
Published by IEC on April 1, 2020
This part of IEC 62686, which is a Technical Specification, defines the minimum requirements for general purpose "off the shelf" COTS (commercial off-the-shelf) integrated circuits and discrete...
This document is referenced by:
JEDEC JESD 88 - JEDEC Dictionary of Terms for Solid State Technology
Published by JEDEC on July 1, 2007
Each term and definition in this dictionary has been included strictly for application within the solid-state industry. Many of the terms and definitions in this dictionary may have applicability...
This document is referenced by:
BS PD IEC TS 62686-1 - Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
Published by BSI on April 30, 2020
A description is not available for this item.
This document is referenced by:
JEDEC JEP 70 - Guide to Standards and Publications Relating to Quality and Reliability of Electronic Hardware
Published by JEDEC on October 1, 2013
This publication contains a listing and description of commonly used quality and reliability related publications applicable to the semiconductor industry. It is intended to be a reference aid in...
This document is referenced by:
IEC 62239-1 - Process management for avionics – Management plan – Part 1: Preparation and maintenance of an electronic components management plan
Published by IEC on September 1, 2018
This part of IEC 62239 defines the requirements for developing an electronic components management plan (ECMP) to guarantee to customers that all of the electronic components in the equipment of the...
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