JEDEC JESD 22-B116
Test Method B116 Wire Bond Shear Test
inactive
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| Organization: | JEDEC |
| Publication Date: | 1 July 1998 |
| Status: | inactive |
| Page Count: | 12 |
Document History
April 1, 2017
Wire Bond Shear Test Method
This test provides a means for determining the strength of a ball bond to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation devices. This measure of...
August 1, 2009
Wire Bond Shear Test Method
This test provides a means for determining the strength of a gold ball bond to a die bonding surface or an aluminum wedge or stitch bond to a die or package bonding surface, and may be performed on...
JEDEC JESD 22-B116
July 1, 1998
Test Method B116 Wire Bond Shear Test
A description is not available for this item.