DSF/EN 60749-19/FprA1
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
pending
| Organization: | DS |
| Status: | pending |
| Page Count: | 4 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
This part of 60749 determines (see note) the integrity of materials and procedures used to attach semiconductors die to package headers or other substrates (for the purpose of this test method, the term "semiconductors die" should be taken to include passive elements) The test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10mm2. it is also not applicable to flip chip technology or to flexible substrates.
Document History
September 27, 2010
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.
June 6, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
This part of 60749 determines (see note) the integrity of materials and procedures used to attach semiconductors die to package headers or other substrates (for the purpose of this test method, the...
DSF/EN 60749-19/FprA1
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
This part of 60749 determines (see note) the integrity of materials and procedures used to attach semiconductors die to package headers or other substrates (for the purpose of this test method, the...
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