DS/EN 60749-19
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
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| Organization: | DS |
| Publication Date: | 27 September 2010 |
| Status: | active |
| Page Count: | 6 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.
Document History
DS/EN 60749-19
September 27, 2010
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.
June 6, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
This part of 60749 determines (see note) the integrity of materials and procedures used to attach semiconductors die to package headers or other substrates (for the purpose of this test method, the...
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
This part of 60749 determines (see note) the integrity of materials and procedures used to attach semiconductors die to package headers or other substrates (for the purpose of this test method, the...
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