scope:

1.1 Scope and object This International Standard has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to : - wafers - singulated bare die - die and wafers with attached connection structures - minimally or partially encapsulated die and wafers It specifies the data formats that may be used for the exchange of data which is covered by other parts of this standard as well as definitions of all parameters used according to the principles and methods of IEC 61360. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between die manufacturer and CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, in accordance with ISO 10303-21, and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope.