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DLA - SMD-5962-84071 REV D

MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, THREE-STATE OCTAL D-TYPE FLIP-FLOP, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 8 September 1992
Status: inactive
Page Count: 14
scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device type shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54HC374 Three-state octal D-type flip flop

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline R D-8 (20-lead, 1.060" × .310" × .200"), dual-in-line package S F-9 (20-lead, .540" × .300" × .100"), flat package 2 C-2 (20-terminal, .358" × .358" × .100"), square chip carrier package

Supply voltage range - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC input voltage - - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc DC output voltage - - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc Clamp diode current - - - - - - - - - - - - - - - - ±20 mA DC output current (per pin) - - - - - - - - - - - ±35 mA DC VCC or GND current (per pin) - - - - - - - - - ±70 mA Storage temperature range - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) - - - - - - - - - 500 mW 2/ Lead temperature (soldering, 10 seconds) - - - - - +260°C Thermal resistance, junction-to-case (θJC) - - - - See MIL-M-38510, appendix C Junction temperature (TJ) - - - - - - - - - - - - - +175°C

Supply voltage - - - - - - - - - - - - - - - - - - - - +2.0 V dc to +6.0 V dc Case operating temperature range - - - - - - - - - - - −55°C to +125°C Input rise or fall time: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - - 0 to 1,000 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 0 to 500 ns VCC = 6.0 V - - - - - - - - - - - - - - - - - - - - 0 to 400 ns Minimum setup time (ts) 3/: TC = +25°C: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - - 100 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 20 ns VCC = 6.0 V - - - - - - - - - - - - - - - - - - - - 17 ns TC = −55°C to +125°C: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - - 150 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 30 ns VCC = 6.0 V - - - - - - - - - - - - - - - - - - - - 25 ns Minimum pulse width (tw) 3/: TC = +25°C: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - - 80 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 16 ns VCC = 6.0 V - - - - - - - - - - - - - - - - - - - - 14 ns TC = −55°C to +125°C VCC = 2.0 V - - - - - - - - - - - - - - - - - - - - 120 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 24 ns VCC = 6.0 V - - - - - - - - - - - - - - - - - - - - 20 ns Minimum hold time (th) 3/ TC = +25°C: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - - 10 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 5 ns VCC = 6.0 V - - - - - - - - - - - - - - - - - - - - 5 ns TC = −55°C to +125°C VCC = 2.0 V - - - - - - - - - - - - - - - - - - - - 10 ns VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 5 ns VCC = 6.0 V - - - - - - - - - - - - - - - - - - - - 5 ns Maximum clock frequency (fmax) 3/ TC = +25°C: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - - 6 MHz VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 30 MHz VCC = 6.0 V - - - - - - - - - - - - - - - - - - - - 35 MHz TC = −55°C to +125°C: VCC = 2.0 V - - - - - - - - - - - - - - - - - - - - 4 MHz VCC = 4.5 V - - - - - - - - - - - - - - - - - - - - 20 MHz VCC = 6.0 V - - - - - - - - - - - - - - - - - - - - 24 MHz

intended Use:

Microcircuits conforming to this drawing are intended for use when military specified do not exist and qualified military devices that will perform the required function are not available for OEM... View More

Document History

June 18, 2021
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, THREE-STATE OCTAL D-TYPE FLIP-FLOP, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Replaceability....
September 23, 2015
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, THREE-STATE OCTAL D-TYPE FLIP-FLOP, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
October 21, 2009
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, THREE-STATE OCTAL D-TYPE FLIP-FLOP, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
January 14, 2002
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, THREE-STATE OCTAL D-TYPE FLIP-FLOP, MONOLITHIC SILICON
A description is not available for this item.
November 9, 1999
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, THREE-STATE OCTAL D-TYPE FLIP-FLOP, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
SMD-5962-84071 REV D
September 8, 1992
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, THREE-STATE OCTAL D-TYPE FLIP-FLOP, MONOLITHIC SILICON
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices"....
April 21, 1989
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, THREE-STATE OCTAL D-TYPE FLIP-FLOP, MONOLITHIC SILICON
A description is not available for this item.
November 24, 1987
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, THREE-STATE OCTAL D-TYPE FLIP-FLOP, MONOLITHIC SILICON
A description is not available for this item.
December 30, 1985
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, THREE-STATE OCTAL D-TYPE FLIP-FLOP, MONOLITHIC SILICON
A description is not available for this item.
September 28, 1984
MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, THREE-STATE OCTAL D-TYPE FLIP-FLOP, MONOLITHIC SILICON
A description is not available for this item.
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