scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following examples.

For device classes M and Q:

For device class V:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 54HC374 Three-state octal D-type flip-flop

The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device.

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC)...................................................... −0.5 V dc to +7.0 V dc DC input voltage range (V_IN).................................................... −0.5 V dc to V_CC +0.5 V dc DC output voltage range (V_OUT).................................................. −0.5 V dc to V_CC +0.5 V dc Clamp diode current (I_IK)....................................................... ±20 mA DC output diode current (I_OK) (per pin)......................................... ±35 mA DC V_CC or GND current (per pin)................................................. ±70 mA Storage temperature range (T_STG)................................................ −65°C to + 150°C Maximum power dissipation (P_D):................................................. 500 mW 4/ Lead temperature (soldering, 10 seconds)........................................ +260°C Thermal resistance, junction-to-case (θ_JC)................................. See MIL-STD-1835 Junction temperature (T_J)....................................................... +175°C 5/

Supply voltage range (V_CC) ..................................................... +2.0 V dc to +6.0 V dc Case operating temperature range (T_C) .......................................... −55°C to + 125°C Input rise or fall time t_r, t_f): V_CC = 2.0 V ............................................................... 0 to 1,000 ns V_CC = 4.5 V ............................................................... 0 to 500 ns V_CC = 6.0 V ............................................................... 0 to 400 ns Minimum setup time (t_s): T_C = +25°C: V_CC = 2.0 V................................................................. 100 ns V_CC = 4.5 V................................................................. 20 ns V_CC = 6.0 V................................................................. 17 ns T_C = −55°C to + 125°C: V_CC = 2.0 V................................................................. 150 ns V_CC = 4.5 V................................................................. 30 ns V_CC = 6.0 V................................................................. 25 ns

Minimum pulse width (t_w): T_C = +25°C: V_CC = 2.0 V ............................................................... 80 ns V_CC = 4.5 V ............................................................... 16 ns V_CC = 6.0 V ............................................................... 14 ns T_C = −55°C to + 125°C: V_CC = 2.0 V ............................................................... 120 ns V_CC = 4.5 V ............................................................... 24 ns V_CC = 6.0 V ............................................................... 20 ns Minimum hold time (t_h): T_C = +25°C: V_CC = 2.0 V ............................................................... 10 ns V_CC = 4.5 V ............................................................... 5 ns V_CC = 6.0 V ............................................................... 5 ns T_C = −55°C to + 125°C: V_CC = 2.0 V ............................................................... 13 ns V_CC = 4.5 V ............................................................... 5 ns V_CC = 6.0 V ............................................................... 5 ns Maximum clock frequency (f_max): T_C = +25°C: V_CC = 2.0 V ............................................................... 6 MHz V_CC = 4.5 V ............................................................... 30 MHz V_CC = 6.0 V ............................................................... 35 MHz T_C = −55°C to + 125°C: V_CC = 2.0 V ............................................................... 4 MHz V_CC = 4.5 V ............................................................... 20 MHz V_CC = 6.0 V ............................................................... 24 MHz

intended Use: