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GMKOREA EDS-M-6611

MECHANICAL WOOD PULP ARTIFICIAL RESIN BOUND COMPRESSION MOLDED

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Organization: GMKOREA
Publication Date: 24 June 2003
Status: inactive
Page Count: 5
scope:

This specification applies to the storage box.

PURPOSE

This specification specifies the requirements of basic property for the mechanical wood pulp artificial resin bound compression molded used in automobiles.

Document History

GMKOREA EDS-M-6611
September 1, 2010
Mechanical Wood Pulp Artificial Resin Bound Compression Molded
Purpose. This specification specifies the requirements of basic property for the mechanical wood pulp artificial resin bound compression molded used in automobiles.
GMKOREA EDS-M-6611
June 24, 2003
MECHANICAL WOOD PULP ARTIFICIAL RESIN BOUND COMPRESSION MOLDED
This specification applies to the storage box. PURPOSE This specification specifies the requirements of basic property for the mechanical wood pulp artificial resin bound compression molded used in...

References

This document references:
GMKOREA EDS-M-0102 - Procedures for Approval of Chemical Raw Material and Quality Control
Published by GMKOREA on September 1, 2011
This standard applies to all Virgin materials and Recyclate used for automobile components. PURPOSE The purpose of this standard is to help improving quality of our parts by defining procedures for...
This document references:
GMKOREA EDS-T-7301 - Test Method for Determining the Residue on Ignition (Ash) of Polymeric Materials
Published by GMKOREA on July 1, 2011
This standard applied to determine the residue on ignition of plastic, elastomers, plastic film, coatings on leathercloths, cardboard, paper, sealing materials etc. PURPOSE The purpose of this...
This document references:
GMKOREA EDS-T-7304 - Test Method for Determining Moisture Content, Water Absorption and Thickness Swell of Fiberboards, Chipboard, Cardboard etc
Published by GMKOREA on May 1, 2012
A description is not available for this item.
This document references:
EDS-T-7305 - Determining Density of Paper, Cardboard, Wood, Fiberboards, Chipboard etc.
Published by GMKOREA on December 1, 2010
A description is not available for this item.
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