DLA - SMD-5962-94573
MICROCIRCUIT, DIGITAL, CMOS, HISTOGRAMMER/ACCUMULATING BUFFER, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 18 April 1994 |
| Status: | inactive |
| Page Count: | 18 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function
01 48410-25 Histogrammer/accumul
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style X CMGA3-P84 84 Pin-grid array
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage . . . . . . . . . . . . . . . . . . . . . . .8.0 V Input, output, or I/O voltage applied range . . . . . . . .GND − 0.5 V to VCC + 0.5 V Storage temperature range (TS) . . . . . . . . . . . . . . .−65°C to 150°C Lead temperature (soldering, 10 seconds) . . . . . . . . . .300°C Junction temperature (TJ) . . . . . . . . . . . . . . . . .175°C Thermal resistance: Junction-to-ambient (ΘJA) . . . . . . . . . . . . . . . .34.3°C/W Junction-to-case (ΘJC) . . . . . . . . . . . . . . . . . .See MIL-STD-1835 Power dissipation at 125°C . . . . . . . . . . . . . . . . .1.46 W
Operating voltage range . . . . . . . . . . . . . . . . . .4.5 V to 5.5 V Ambient operating temperature range (TA) . . . . . . . . . .−55°C to 125°C
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . XX percent 2/
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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