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BSI - BS EN 61760-3

Surface mounting technology Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering

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Organization: BSI
Publication Date: 30 June 2010
Status: inactive
Page Count: 28
ICS Code (Electronic component assemblies): 31.190

Document History

BS EN IEC 61760-3
March 31, 2021
Surface mounting technology Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
A description is not available for this item.
BS EN 61760-3
June 30, 2010
Surface mounting technology Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
A description is not available for this item.

References

This document references:
IEC 60068-2-21 - Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices
Published by IEC on January 1, 2012
This part of IEC 60068 is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or...
This document references:
EN IEC 60068-2-20 - Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by CENELEC on May 1, 2021
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068‑2‑58. This...
This document references:
EN IEC 60068-2-21 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
Published by CENELEC on September 1, 2021
This part of IEC 60068 is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or...
This document references:
EN IEC 60068-2-82 - Environmental testing - Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Published by CENELEC on July 1, 2019
This part of IEC 60068 specifies tests for the whiskering propensity of surface finishes of electric or electronic components and mechanical parts such as punched/stamped parts (for example, jumpers,...
This document references:
EN IEC 60286-5 - Packaging of components for automatic handling - Part 5: Matrix trays
Published by CENELEC on June 1, 2018
This part of IEC 60286 describes the common dimensions, tolerances and characteristics of the tray. It includes only those dimensions that are essential for the handling of the trays for the stated...
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