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BSI - BS EN IEC 61760-3

Surface mounting technology Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering

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Organization: BSI
Publication Date: 31 March 2021
Status: active
Page Count: 34
ICS Code (Electronic component assemblies): 31.190

Document History

BS EN IEC 61760-3
March 31, 2021
Surface mounting technology Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
A description is not available for this item.
June 30, 2010
Surface mounting technology Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
A description is not available for this item.

References

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