scope:

This document specifies test methods and requirements for Pb-free Subassembly Modules. Module testing may be done on a representative part number, and is not required on all part numbers provided there is sufficient similarity in terms of size, component types, printed wiring board structure and materials, etc. Examples of modules include, but are not limited to, power supply modules and optics modules that are later added to a higher level assembly. This document exclusively focuses on those Restriction of Hazardous Substances (RoHS) items specific to the introduction of Pb-free components and does not address requirements for device specific qualification.

Purpose

Telecom product that is eligible for the "Network Infrastructure Equipment" Pb- in-solder exemption (EU RoHS Directive exemption 7b) should continue to use subassembly modules manufactured using SnPb solder as referenced in GR-78-Core. The Telecom industry will not accept modules that use SnPb finished components but are soldered with Pb-free solders. In view of reliability concerns, the telecom users require qualification of RoHS6 subassembly modules (i.e., those assembled with Pb-free solder) as defined below. This document provides a set of methods and requirements for telecom industry qualification testing to determine acceptability of RoHS6 subassembly modules.

Application

This document (and supporting documentation) is intended to be used by equipment manufacturers wishing to deploy small modules in carrier network equipment when those modules use a solder composition other than the historical SnPb (tin-lead) solder.